Intel’s advanced packaging complex, assembly manufacturing in M’sia to kickstart this year

2026-03-17 - 05:03

Intel Corporation, the world’s largest semiconductor producer, was among the pioneers of Malaysia’s electrical and electronics industry, beginning operations in Penang in 1972. (X pic) PETALING JAYA: Intel Corporation’s advanced packaging complex and assembly manufacturing is expected to begin operations later this year, Prime Minister Anwar Ibrahim said. According to a social media post, this development was revealed during a briefing yesterday with Intel CEO Lip-Bu Tan and his team. Anwar said the briefing focused on the development of the new complex, as well as assembly and testing operations, which are key components of Intel’s investment plans in Malaysia. “Executive vice-president and general manager of Intel Foundry, Naga Chandrasekaran, outlined plans to launch the first phase of the complex with assembly and testing for advanced packaging. “I welcomed Intel’s decision to begin operations for the complex later this year,” he said. Anwar said the briefing also emphasised the importance of continuous training and skills enhancement for local talent along the semiconductor value chain. “The government machinery will continue to act as a partner and facilitator for investments that clearly provide long-term benefits, as envisioned in the plans that have been launched, including the National Semiconductor Strategy,” he said. Intel, the world’s largest semiconductor producer, was among the pioneers of Malaysia’s electrical and electronics industry, beginning operations in Penang in 1972. In December last year, the US chipmaker announced an additional US$208 million (RM860 million) investment to expand packaging capacity. In 2023, the company committed RM30 billion over the next 10 years to grow operations in Penang and Kulim, Kedah. In 2021, it invested more than US$7 billion to build a new chip-packaging and testing factory in Malaysia.